PIC Bootcamp
PIC Bootcamp
We teach people to create photonic-integrated devices for real-world applications.
Our Courses
Explore our courses, tailored to your experience and learning goals. Each course provides a strong foundation and a pathway to deeper understanding. Begin with an Introduction to Photonic Integrated Circuits (PICs), then move on to hands-on modules that bring core PIC functionalities to life. Continue with an introduction to design and layout for fabrication, followed by a course on packaging. Complete the full programme, and you’ll leave with your very own packaged PIC—a tangible result of your learning journey.
PIC Introduction
Provides you with an accessible overview of Photonic Integrated Circuits (PICs), including their capabilities, limitations, and commercial considerations. The session introduces the development process and ecosystem, helping participants understand where to begin and how PICs fit into broader technology and market landscapes.
Hands-on introduction to PICs and their Functionality
Provides a practical introduction to the basic functionality of photonic integrated circuit (PIC) components, building an understanding of how physical variability affec the importance of efficient light coupling. This module builds on the concepts introduced in the Explorer Module and prepares participants for more advanced training in Layout/PDKs, Fabrication, and Packaging.
Design – Introduction to Simulation
Provides you with a practical introduction to Ansys Lumerical, helping you become familiar with its interface, main features, and potential applications.
Design - Introduction to Chip Circuit Layout for Fabrication
Familiarises you with the steps required to translate a PIC (Photonic Integrated Circuit) design into a foundry-compatible layout.
Introduction to Fabrication
This introduces you to the key steps of PIC fabrication, giving you practical insight into process constraints and how these affect design layouts and failure rates.
Introduction to Packaging
Familiarises you with the key steps and challenges in packaging Photonic Integrated Circuits (PICs). The course will provide practical insight into how packaging influences performance, reliability, and cost, helping participants design layouts that are more packaging-aware and less prone to integration issues.