Introduction to PIC Packaging

This module covers the fundamentals of PIC packaging, emphasising its critical role in the design–fabrication–application chain. Participants will gain insights into key packaging techniques through demonstrations of alignment, bonding, fibre coupling, electrical interconnects, signal integrity, and thermal management. Hands-on activities at multiple workstations will provide practical experience with essential packaging steps, while case studies will highlight common challenges in PIC packaging and their impact on design decisions.